Company Introduction

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Company Head Image

Telephus Inc. is a venture corporation that develops, manufactures, and markets wireless telecommunication components with its own design capability and innovative smart substrate technology. The value of Telephus products is its breakthrough, patented manufacturing technology for smart silicon substrates, which creates demonstrable customer benefits in term of cost, function, and product reliability.

For instance, with a new concept of RF IC design (called "TR-Array") spun off from smart substrate technology, Telephus has received an award from ECTC, US, 2000 (sponsored by Motorola). Smart Substrate Technology provides outstanding cost benefit by integrating numerous passive components of GaAs (or SiGe) RF IC into a silicon substrate without any sacrifice of electrical property.

In addition, for diversified product lines in the semiconductor component industry, Telephus has developed an innovative ACF (Antistrophic Conductive Film: Advanced Electronic Package Material) showing significant improvement of T/C (Thermal Cycle) reliability of flip chip on organic substrates with lower CTE and higher modulus of NCF layer.

Detailed Company Information

  • Company NameH&S HighTech Corp.
  • Business TypeManufacturer
  • Year Established1998
  • LocationSouth Korea
  • Main MarketsChina,Hong Kong(China),Japan,Malaysia,Philippines
  • Total Employees 1-50 People
  • Homepage www.telephus.com
  • PresidentIlkwon Dong
  • Phone+82-42-866-1300
  • FAX+82-42-866-1308
  • Address25-11, Jang-dong, Yuseong-gu, Daejeon, 305-343, Korea
  • Product Category Telecommunications > Other Telecommunications Products

Additional Introduction

Telephus Inc. is a venture corporation that develops, manufactures, and markets wireless telecommunication components with its own design capability and innovative smart substrate technology. The value of Telephus products is its breakthrough, patented manufacturing technology for smart silicon substrates, which creates demonstrable customer benefits in term of cost, function, and product reliability.

For instance, with a new concept of RF IC design (called "TR-Array") spun off from smart substrate technology, Telephus has received an award from ECTC, US, 2000 (sponsored by Motorola). Smart Substrate Technology provides outstanding cost benefit by integrating numerous passive components of GaAs (or SiGe) RF IC into a silicon substrate without any sacrifice of electrical property.

In addition, for diversified product lines in the semiconductor component industry, Telephus has developed an innovative ACF (Antistrophic Conductive Film: Advanced Electronic Package Material) showing significant improvement of T/C (Thermal Cycle) reliability of flip chip on organic substrates with lower CTE and higher modulus of NCF layer.